Light absorption apparatus

ABSTRACT

A light absorption apparatus includes a substrate, a light absorption layer above the substrate on a first selected area, a silicon layer above the light absorption layer, a spacer surrounding at least part of the sidewall of the light absorption layer, an isolation layer surrounding at least part of the spacer, wherein the light absorption apparatus can achieve high bandwidth and low dark current.

PRIORITY ENTITLEMENT AND RELATED APPLICATIONS

This application is a continuation application of U.S. patentapplication Ser. No. 15/147,847, entitled “LIGHT ABSORPTION APPARATUS,”filed May 5, 2016, which is a continuation-in-part application of U.S.patent application Ser. No. 14/940,572, entitled “LIGHT ABSORPTIONAPPARATUS,” filed Nov. 13, 2015, which claims priority to U.S.Provisional Patent Application No. 62/078,986, filed Nov. 13, 2014; U.S.Provisional Patent Application No. 62/081,574, filed Nov. 19, 2014; U.S.Provisional Patent Application No. 62/121,448, filed Feb. 26, 2015; U.S.Provisional Patent Application No. 62/126,698, filed Mar. 1, 2015; andU.S. Provisional Patent Application No. 62/197,098, filed Jul. 26, 2015;all of which are incorporated by reference herein in their entireties.

U.S. patent application Ser. No. 15/147,847 also claims priority to U.S.Provisional Patent Application No. 62/157,458, entitled “FRONTSIDEINCIDENCE DOUBLE PASS PHOTODETECTOR,” filed May 5, 2015; and U.S.Provisional Patent Application No. 62/193,133, entitled “BACK SIDEPROTECTION,” filed Jul. 16, 2015; all of which are incorporated byreference herein in their entireties.

BACKGROUND OF THE INVENTION Field of the Invention

The present disclosure relates to a light absorption apparatus,especially to a semiconductor based photodiode.

Description of Prior Art

A semiconductor based photodiode typically includes an intrinsicsemiconductor region between a P-type semiconductor and an N-typesemiconductor doping regions. The presence of an intrinsic region is incontrast to an ordinary PN diode, and the photons can be absorbed in theintrinsic region and the generated photo-carriers can be collected fromthe P-type and N-type regions.

SUMMARY OF THE INVENTION

It is an object of the present disclosure to provide a semiconductorbased photodiode with lower dark current and high absorption. Morespecifically, the photodiode includes germanium as the photo-absorptionmaterial based on a silicon substrate.

According to one aspect of the present disclosure, a method for forminga light absorption apparatus, includes: (1) forming an isolation layerabove a substrate, (2) removing part of the isolation layer to expose aselected area, (3) forming a spacer covering at least part of thesidewall of the selected area, (4) epitaxially growing a firstabsorption layer including germanium within the selected area, (5)forming a passivation layer including Silicon above the first absorptionlayer, wherein the surface leakage current can be reduced by passivatingthe first absorption layer, and a low leakage and high sensitivity lightabsorption apparatus can be formed.

According to another aspect of the present disclosure, a method forforming a light absorption apparatus, includes: (1) forming a firstdoping region at least partially embedded in a substrate, (2) forming afirst layer above the first doping region, (3) forming a second layerincluding germanium above the first layer, (4) forming a third layercovering the second layer, (5) forming a fourth layer including oxideabove the third layer, (6) forming a fifth layer including nitride abovethe fourth layer, (7) removing the fifth layer and stopping on thefourth layer, (8) forming a sixth layer above the fourth layer, whereinthe second layer has lattice mismatch to the surface of the substrate,and the sixth layer has a predetermined thickness such that apredetermined reflectivity can be achieved when an optical signalpassing and being reflected by the sixth layer, at least part of theoptical signal is absorbed by the second layer.

According to still another aspect of the present disclosure, a lightabsorption apparatus includes: a substrate, a light absorption layerabove the substrate on a first selected area, a passivation layerincluding Silicon above the light absorption layer, a spacer surroundingat least part of the sidewall of the light absorption layer, anisolation layer surrounding at least part of the spacer, wherein thelight absorption apparatus can achieve high bandwidth and low leakagecurrent.

According to still another aspect of the present disclosure, a lightabsorption apparatus includes: a substrate, a light absorption layerformed above the substrate and includes an upper part within a firstopening and a lower part within a second opening at least partiallyoverlapping with the first opening, a passivation layer includingsilicon above the upper part of the light absorption layer, a spacersurrounding at least part of the sidewall of the upper part of the lightabsorption layer, an isolation layer surrounding at least part of thespacer and the lower part of the light absorption layer, wherein lightabsorption apparatus can achieve high bandwidth and low leakage current.

BRIEF DESCRIPTION OF THE DRAWINGS

One or more embodiments of the present disclosure are illustrated by wayof example and not limitation in the figures of the accompanyingdrawings, in which like references indicate similar elements. Thesedrawings are not necessarily drawn to scale.

FIG. 1 shows a PIN photodiode structure.

FIGS. 2A to 2H show implementations to form a photodiode structure.

FIGS. 3A to 3C show implementations to form a counter doping layer in aphotodiode structure.

FIGS. 4A to 4C show implementations to form a diffusion control layeror/and counter doping layer in a photodiode structure.

FIGS. 5A to 5B show implementations of the structure shown in FIG. 4A.

FIGS. 6A to 6E are the sectional views illustrating the manufacturingsteps of forming a photodiode with etch/polish stopper according toanother implementation of the present disclosure.

FIGS. 7A to 7E are the sectional views illustrating the manufacturingsteps of forming a photodiode with etch/polish stopper according tostill another implementation of the present disclosure.

FIGS. 8A to 8F are the sectional views illustrating the manufacturingsteps of forming a photodiode with etch/polish stopper according tostill another implementation of the present disclosure.

FIGS. 9A to 9D are the sectional views illustrating the manufacturingsteps of forming a photodiode with conformal selective Ge etchingprocess as isolation according to an implementation of the presentdisclosure, and FIG. 9E is a sectional view showing photodiode withdoping region instead of etching process as the isolation.

FIGS. 10A to 10L are the sectional views illustrating forming aphotodiode with sidewall passivation, or/and interfacial layer, or/andmultiple layer forming steps.

FIGS. 11A to 11K are the sectional views illustrating forming aphotodiode with sidewall passivation, or/and interfacial layer.

FIGS. 12A to 12K are the sectional views illustrating forming aphotodiode with multiple layer forming steps, or/and sidewallpassivation, or/and interfacial layer.

FIG. 13 is a sectional view showing one photodiode of the presentdisclosure integrated with a transistor.

FIG. 14 shows a conventional chemical-vapor-deposition (CVD) basedheteroepitaxial process that may cause substrate backside contamination.

FIG. 15 shows an embodiment of a technique for reducing substratebackside contamination from blanket CVD-based heteroepitaxy.

FIGS. 16A to 16F are example processes for manufacturing the embodimentshown in FIG. 15.

FIG. 17 shows a photodetector structure on which the introducedtechnique for reducing substrate backside contamination is applied.

FIGS. 18A to 18C are sectional views of a frontside incidencedouble-pass photodetector with an epitaxially grown etch-stop layer, inaccordance with some embodiments.

FIGS. 19A to 19F are different examples of integrating the PD structuresintroduced in FIGS. 18A to 18C with transistors.

FIG. 20 shows another technique to implement the etch-stop layerintroduced here.

FIG. 21 shows an example of integrating the PD structure introduced inFIG. 20 with transistors.

DETAILED DESCRIPTION OF THE INVENTION

FIG. 1 shows a photodiode 10 a, which comprises a silicon (Si) substrate100 a, an n-type doped region 110 a within the Si substrate 100 alocated near the upper surface of the Si substrate 100 a, an intrinsicgermanium (Ge) region 130 a arranged on the upper surface of the Sisubstrate 100 a, a p-type Ge region 132 a arranged on the upper surfaceof the intrinsic Ge region 130 a and an oxide passivation 180 asurrounding the intrinsic Ge region 130 a and the p-type Ge region 132 aas well as covering the upper surface of the Si substrate 100 a.

For the structure shown as FIG. 1, a heterogeneous interface is presentbetween the Ge region 130 a and the underlying Si substrate 100 a.Heterogeneous interface can be implemented by using heteroepitaxy, atype of epitaxy performed by growing a crystalline material of differentelemental configurations than the crystalline substrate that is grownon. Examples include but are not limited to, GaN on sapphire, GaN on Si,Ge on Si. The crystalline materials can be elemental or compoundsemiconductors.

For some applications, electrically intrinsic material property isneeded on either grown film or substrate or both for better deviceperformance. Intrinsic semiconductor is a semiconductor exhibitingelectrically neutral property. Here a region with carrier concentrationbelow 10¹⁷ cm⁻³ is considered intrinsic. However, intrinsic material issometimes difficult to obtain at the heterogeneous interface.Electrically polarized layers often unintentionally formed near theinterface due to lattice-mismatched defect formation, inter-diffusion(or cross diffusion) between two materials (Components of one materialcan sometimes become the other material's active dopants), contaminationduring film growth, or energy band alignment induced Fermi level pinningFor example, a p-type Ge layer is generally formed at the interface ofGe-on-Si system.

Furthermore, if such dislocations and other types of defects formed atthe heterogeneous interfaces due to lattice mismatch, are located withinthe semiconductor depletion region, it could increase the photodiode'sdark current, namely leakage current under dark condition, due totrap-assisted carrier generation and therefore degrade the performanceas well as narrows the design window. It is observed that thetrap-assisted generation mechanism can be effectively reduced bypassivating this defective region with high doping concentration suchthat the defect trap states are filled with extrinsic dopant assistedcarriers to neutralize the carrier generation rate. To achieve thisdoping passivation technique, precise dopant control in highly-defectivearea is sometimes difficult due to the nature of defect assisted dopantdiffusion. Uncontrolled dopant diffusion may cause unwanted performanceand reliability penalties, such as device responsivity degradation andyield reduction.

In some of the implementations of fabricating a Ge on Si photodiode asshown in FIG. 1, Ge mesa patterning is required to define the opticalabsorption area (namely the intrinsic Ge region 130 a in FIG. 1) if ablanket type epitaxial growth is used. Blanket type epitaxial growth isan epitaxial growth performed on the entire substrate wafer surface.Reactive ion etching (RIE) and inductively coupled plasma (ICP) etchingare common methods for patterning Ge mesas after the blanket epitaxialgrowth where desired mesa sidewall angles are achieved with carefullyengineered anisotropic etch recipes. However, anisotropic etch normallyinvolves ion bombardment on patterned structures and often leads to Gesidewall surface damage. Damaged sidewall surfaces result in defects anddangling bonds that increases the photodiode dark current. To avoid suchdevice degradation, a conformal damage-free selective Ge etch approach(selective over Si) is presented to remove the anisotropic etch induceddamaged surface layers. For example, a selective etch can be defined asetch rate differences between Ge and Si larger than a 5 to 1 ratio.

For a higher operation speed photodiode or photodetector, the thicknessof the photo-sensitive layer, namely the intrinsic Ge region 130 a shownin FIG. 1, needs to be thin enough to minimize carrier transit time butat the expense of lower photo-responsivity. To improve responsivity andstill maintain high speed, an optical reflector can be placed atop thephoto-sensitive layer. The reflector materials can include onedielectric layer (e.g., oxide or nitride), multiple dielectric layers,metal (e.g., Aluminum), or any combinations of materials listed above.Forming such reflectors requires strict thickness tolerance (<5%) toensure the targeted reflectivity is within a desired spectrum, which canbe relatively difficult for conventional foundries. An etch or polishstopping layer is presented in this disclosure to improve the thicknessuniformity control for the desired reflector structure. Hereinafter, thelight absorption apparatus will be exemplified as a PIN photodiode.However, this particular example is not a limitation for the scope ofthe present disclosure. For example, a NIP structure can also beimplemented by certain implementations of this disclosure. Furthermore,other light absorption material such as SiGe with various Ge contentscan be used.

FIGS. 2A to 2F are the sectional views illustrating the manufacturingsteps of the light absorption apparatus according to the firstembodiment of the present disclosure, where a counter doping layer ispresented to reduce the operation bias or/and reduce the leakage currentat the heterogeneous interface. As shown in FIG. 2A (step S100), asemiconductor substrate 100 is provided and n+ doped layer 110 is formednear the upper face of the substrate 100. The n+ doped layer 110 may beformed methods such as, but not limited to, ion implantation, gas phasediffusion and epitaxial layer growth with simultaneous in-situ dopingcombined with optional thermal treatment procedures for dopant diffusionand activation. Two high doping regions 102 for reduced resistancecontacts are formed with higher doping levels than that of the n+ dopedlayer 110. For example, the doping concentration is larger than 1×10¹⁹cm⁻³ for the n+ doped layer 110, and is larger than 1×10²⁰ cm⁻³ for thecontacts 102.

In some embodiments of the present disclosure and as shown in FIG. 2A,the semiconductor substrate 100 is a bulk semiconductor substrate. Whena bulk semiconductor substrate is employed, the bulk semiconductorsubstrate can be comprised of any semiconductor material including, butnot limited to, Si, Ge, SiGe, SiC, SiGeC, InAs, GaAs, InP or other likeIII/V compound semiconductors. Multilayers of these semiconductormaterials can also be used as part of the bulk semiconductor substrate.In one embodiment, the semiconductor substrate 100 comprises a singlecrystalline semiconductor material, such as, for example, singlecrystalline silicon. In another embodiment, a semiconductor-on-insulator(SOI) substrate (not specifically shown) is employed as thesemiconductor substrate 100. When employed, the SOI substrate includes ahandle substrate, a buried insulating layer located on an upper surfaceof the handle substrate, and a semiconductor layer located on an uppersurface of the buried insulating layer. The handle substrate and thesemiconductor layer of the SOI substrate may comprise the same, ordifferent, semiconductor material. The term “semiconductor” as usedherein in connection with the semiconductor material of the handlesubstrate and the semiconductor layer denotes any semiconductingmaterial including, for example, Si, Ge, SiGe, SiC, SiGeC, InAs, GaAs,InP or other like III/V compound semiconductors. Multilayers of thesesemiconductor materials can also be used as the semiconductor materialof the handle substrate and the semiconductor layer. In one embodiment,the handle substrate and the semiconductor layer are both comprised ofsilicon. In another embodiment, hybrid SDI substrates are employed whichhave different surface regions of different crystallographicorientations. In this example, the semiconductor substrate 100 isexemplified as silicon substrate 100.

As shown in FIG. 2B (step S102), an epitaxially-deposited lightabsorption epitaxial layer (such as a Ge epitaxial layer) 130 is formedatop the doped layer 110 and further includes a counter doping layer 132between the doped layer 110 and the Ge epitaxial layer 130. In someimplementations, the thickness of the counter doping layer 132 can rangefrom 1 nm to 150 nm, dependent on the doping profile near the interface.The dopants inside the counter doping layer 132 should be able toprovide similar free carrier concentration to compensate for thebuilt-in potentials/carriers at the interface by providing oppositecharge polarity for electrical neutralization and to reduce the built-inpotential and hence the operation bias and/or leakage current. ForGe-on-Si system, the interface is naturally p-type and therefore,dopants inside counter doping layer 132 preferably are n-type dopants,for example, As, P or their combinations. The counter doping layer 132can be formed by in-situ doping during epitaxially growing the Geepitaxial layer. In an in-situ doping process, the dopant is introducedduring the deposition of the crystalline semiconductor material.Alternatively, the counter doping layer 132 can be formed otherapproaches such as, but not limited to, ion implantation with n-typedopants. The counter doping layer may be of same material as layer 130or a different material such as SiGe with various Ge contents. In someimplementations, additional layers may be added in-between layer 132 andlayer 130 to reduce layer 132 dopings from diffusion towards layer 130.For example, this optional layer may be of SiGe material with various Gecontents. After the Ge epitaxial layer 130 and the counter doping layer132 are formed, an oxide cap 138 is formed atop the Ge epitaxial layer130 to protect the Ge surface.

As shown in FIG. 2C (step S104), after the oxide cap 138 is formed,lithography and etching processes are performed to define a Ge mesaregion 140 and the counter doping mesa region 142, to expose the uppersurface portion of the silicon substrate 100.

As shown in FIG. 2D (step S106), suitable etchant is used to laterallyrecess the Ge epitaxial mesa region 140 or/and the counter doping mesaregion 142.

As shown in FIG. 2E (step S108), a passivation layer 150 is formed atopthe resulting structure to passivate the Ge surface and p-type dopedregion 144 is formed near the upper surface of the Ge mesa region 140 bysemiconductor manufacturing processes such as ion implantation. In someimplementations, the passivation layer 150 can be amorphous silicon(a-Si) or poly-crystalline silicon (poly-Si). In other implementations,during the doping process of region 144, passivation layer 150 can bedoped simultaneously and used for contacts formation including salicide.In some implementations, the area of the doped region 144 can havedifferent shape from the mesa region 140 when viewing from the top. Forexample, the shape of the mesa region 140 can be rectangular and theshape of the doped region 144 can be circular. In some implementations,the area of the doped region 144 can have similar shape as the mesaregion 140 when viewing from the top. For example, the shape of the mesaregion 140 and the doped region 144 can both be rectangular or circular.

As shown in FIG. 2F (step S110), inter-layer dielectric (ILD) layer 152is formed atop the resulting structure with a topography due to the Gemesa, and a CMP (Chemical Mechanical Polishing) process is performed toreduce the surface topography. Inter-layer dielectric (ILD) may bedeposited several times to attain the desired thickness. Afterwards,contact opens 154 are defined through lithography and etching processesto expose the highly doped silicon surface 102 and some part ofpassivation layer 150.

As shown in FIG. 2G (step S112), salicide 158 is formed atop the siliconsubstrate 102 surface by introducing metals such as Ni, Co, Ti, Ptfollowed by thermal forming processing and then removing the un-reactedparts. Then tungsten plugs (W plugs) 156 is formed within the contactopens 154 atop the silicide 158.

As shown in FIG. 2H (step S114), a metal interconnect (M1 layer) 160 isformed to provide electrical connection to external circuits. In someimplementations, if the optical signal is incident from the top of FIG.2H, an ARC coating can be added on top of the photodiode by firstetching an opening from ILD 152 on top of the Ge mesa region 140. Insome implementations, if the optical signal is incident from the bottomof FIG. 2H, an ARC coating can be added on the bottom top of thephotodiode by first thinning the substrate.

In this implementation, the counter doping mesa region 142 below the Gemesa region 140 with n-type dopants and suitable thickness (1 nm to 150nm) is formed to compensate the p-type heterogeneous interface reducethe built-in potential and hence the operation bias and/or leakagecurrent. Note that in FIGS. 2A-2H, two contact points shown for both thesubstrate contact and the upper absorption region contacts are forillustrative purpose in the 2D cross-section views. In someimplementations, single continuous contact via or ring to the substrateand the absorption region can also be formed to extract photo-generatedcarriers from the light absorption region. Also note that in FIGS.2E-2H, the passivation layer 150 shown covering the light absorptionregion is for illustrative purpose, and this passivation layer 150 canalso extend into other regions as long as it does not prohibit thetungsten plugs (W plugs) 156 or other forms of contact vias to makingelectrical connection to the doped region 102 and 144. Furthermore, thesegmented doped layer 110 in FIGS. 2E-2H are for illustrative purposesand in some implementations, it may extend into other regions. The Pdoped layer 144 in FIGS. 2A-2H are for illustrative purposes and in someimplementations, it may extend to the sidewalls of layer 140 in otherembodiments.

FIGS. 3A to 3C show other implementations to form an intrinsic regionnear the heterogeneous interface. As shown in FIG. 3A, the step S102corresponding to FIG. 2B can be further described by step S102a withfollowing sub-steps: a counter doping layer 122 is formed on uppersurface of the Si substrate 100, where the counter doping layer 122 canbe formed by ion implantation. Afterward, a layer 130 is formed. Asshown in FIG. 3B, the step S102 corresponding to FIG. 2B can be replacedby a step S102 with following sub-steps: a first counter doping layer122 a is formed on upper surface of the Si substrate 100, where thefirst counter doping layer 122 a can be formed by ion implantation.Afterward an epitaxially-grown Ge layer 130 is formed atop the substrate100 and the Ge epitaxial layer 130 has a second counter doping layer 132a. The heterogeneous interface is present between the first counterdoping layer 122 a (Si-based material) and the second counter dopinglayer 132 a (Ge-based material). In some implementations, the thicknessof the first counter doping layer 122 a ranges from 1 nm to 150 nm,depending on the doping profile near the interface. Moreover, thedopants inside the first counter doping layer 122 a should be able toprovide similar free carrier concentration as those built-inpotential/carriers in Ge epitaxial layer 130 but with opposite chargepolarity for electrical neutralization. In some implementations, thethickness of the second counter doping layer 132 a ranges from 1 nm to150 nm. Moreover, the dopants inside the second counter doping layer 132a should be able to provide similar free carrier concentration as thosebuilt-in potential/carriers in Si/Ge interface but with opposite chargepolarity for electrical neutralization due to P-type interface betweenSi and Ge caused by p-type interfacial defects and heterojunction holeconfinement.

As shown in FIG. 3C, the step S102 corresponding to FIG. 2B can bereplaced by a step S102c with following sub-steps: A Si epitaxial layer120 is formed on the Si substrate 100. The Si substrate 100 can be dopedat the interface near the epitaxial layer 120. An epitaxially-grown Gelayer 130 is formed atop the Si epitaxial layer 120 and the Ge layer 130further includes a counter doping layer 132. The thickness of thecounter doping layer 132 ranges from 1 nm to 150 nm is preferably dopedby n-type dopants, for example, As, P or their combinations tocompensate the p-type interface. The counter doping layer 132 can beformed by in-situ doping during epitaxially growing the Ge layer or byion implantation with n-type impurities. In some implementations, the Siepitaxial layer 120 can provide multiple purposes including reducing thedopant diffusions from the doped substrate, or/and to reduce thejunction capacitance due to its smaller dielectric index than Ge.

In the examples shown in FIGS. 2B to 2H, the counter doping layer or thecounter doping mesa can be broadly referred to as an interfacial layerbetween a silicon layer and another epitaxial layer including germanium.The major composition of the counter doping layer can be either siliconor germanium or their alloy. In the example shown in FIGS. 3A, thecounter doping layer 122 can be broadly referred to as an interfaciallayer between the silicon substrate 100 and the Ge epitaxial layer 130.In the example shown in FIG. 3B, the first counter doping layer 122 aand the second counter doping layer 132 a can be broadly referred to asan interfacial layer between the silicon substrate 100 and the Geepitaxial layer 130 even though two layers are involved in this example.In the example shown in FIG. 3C, the counter doping layer 132 can bebroadly referred to as an interfacial layer between the siliconsubstrate 100 and the Ge epitaxial layer 130 even though the Siepitaxial layer 120 is sandwiched between the silicon substrate 100 andthe counter doping layer 132. In the present disclosure, the interfacialcounter doping layer can be a single layer or multiple layers between alayer A and a layer B and provides an intrinsic region between the layerA and the layer B. Moreover, the interfacial layer is not necessary tobe in direct contact with one of the layer A and the layer B, otherlayer can be interposed between the interfacial layer and the layer A,or between the interfacial layer and the layer B as long as asubstantially intrinsic region can be present between the layer A andthe layer B.

FIGS. 4A to 4C are the sectional views illustrating the manufacturingsteps of forming a photodiode with reduced defect assisted dopantdiffusion according to an implementation of the present disclosure. Asshown in FIG. 4A, a doping layer 200 is formed atop the substratematerial 100 by either epitaxial growth or ion implantation. Then adopant control layer 210 is formed above the doping layer 200. In someimplementations, the dopant control layer 210 includes silicongermanium, the doping layer 200 includes germanium or silicon germaniumand the dopant inside the doping layer 200 includes phosphorous (P). Anepitaxial layer 130 including Ge is formed atop the dopant control layer210 as the photo-sensitive region, and a top doped layer 135 is formedatop the epitaxial layer 130. In some implementations, the dopants inthe top doped layer 135 include boron (B).

In some implementations, the doping layer 200 can be formed by drivingdopants from substrate material 100 into initially undoped 200 layerregion. The driving process can be done after dopant control layer 210and at least part of epitaxial layer 130 is formed. The material of theepitaxial layer 130 can be, but not limited to, Si, SiGe with Ge contentfrom 1% to 100%. The material of the dopant control layer 210 can be,but not limited to SiGe with Ge content less than that from epitaxiallayer 130, carbon-doped SiGe, or carbon-doped Ge. The material of thedoping layer 200 can be, but not limited to, highly-doped Ge,highly-doped SiGe with Ge content no higher than epitaxial layer 130 andno less than dopant control layer 200.

The doped layer 200 has the same electrical polarity as that of the Sisubstrate 100 (for example n-type doping). If Si substrate 100 is indirect contact with the Ge epitaxial layer 130 with lattice mismatch, itwill induce defects and lead to higher dark current and faster dopantdiffusion. As a result, the dopant control layer 210 is designed toplace near the Si/Ge interface as dopant block to allow dopants fromsubstrate 100 to be driven into the doping layer 200 only for reducingdark current generation by passivating defect stats without going deeperinto the epitaxial 130 region and leading to device degradation. In someimplementations, the doped layer 200 can function as a counter dopinglayer as described before to reduce the operation bias and/or leakagecurrent.

As shown in FIG. 4B, it is similar to FIG. 4A except the top doped layer135 is replaced by a heterogeneous top doped layer 136 with differentmaterial composition than the photo-sensitive material below. Theheterogeneous doped layer 136 is made out of Si or SiGe such that minoror zero lattice mismatch is introduced between the Ge epitaxial layer130 and the heterogeneous top doped layer 136.

As shown in FIG. 4C, it is similar to FIG. 4B except that another set ofdoping layer 200 b and dopant control layer 210 b is introduced betweenthe photo-sensitive material and the top doped layer 136 to improve theheterogeneous interface quality. The dopant control layer 210 b isintroduced to reduce the dopant diffusion from the top doped layer 136into the photo-sensitive region 130. The top doped layer 136 can includeSi, Ge or their combination. The dopants in the top doped layer 136 caninclude B, P, As and their combination. In some implementations, thedoping layer 200 b can have the same doping polarity as the top dopedlayer 136. In some implementations, the doping layer 200 b can functionas a counter doping layer as described before to reduce the interfacebuilt-in potential and reduce the operation bias.

In the examples shown in FIGS. 4A to 4B, the doped layer 200 and thedopant control layer 210 can be referred to as an interfacial layerbetween the Si substrate 100 and the epitaxial layer 130 even there aretwo layers between the Si substrate 100 and the epitaxial layer 130 inthose examples. Similarly, in the example shown in FIG. 4C, the dopinglayer 200 b and the top dopant control layer 210 b can be referred to asan interfacial layer between the top doped layer 136 and the epitaxiallayer 130. In the present disclosure, the interfacial layer can be asingle layer or multiple layers between a layer A and a layer B andcontrol dopants diffusion between the layer A and the layer B. Moreover,the interfacial layer is not necessary to be in direct contact with oneof the layer A and the layer B, other layer can be interposed betweenthe interfacial layer and the layer A, or between the interfacial layerand the layer B as long as dopant diffusion can be controlled within theinterfacial layer between the layer A and the layer B. In someimplementations, the relative position of the dopant control layer andthe doping layer can be interchanged, namely the dopant control layercan be either above or below the doping layer. In some implementations,the doping layer can function as the counter doping layer as describedbefore.

FIGS. 5A to 5B show one implementation of the structure shown in FIG.4A. An epitaxial layer 130 including intrinsic-Ge is grown on a N-typephosphorus-doped Si substrate 100 by first growing a seeding layer 200has similar material composition as the epitaxial layer 130, and thengrowing a dopant control layer 210 including Si or SiGe function toreduce phosphorus diffusion into the epitaxial Ge layer where itdiffuses fast and can compromise the desired intrinsic property. Thethickness and location of the seeding layer 200 and the dopant controllayer 210 can be well controlled during the growth. In someimplementations, the dopant control layer 210 ranges from 50 nm to 150nm and including SiGe. As shown in FIG. 5B, a top doped layer 135, whichhas opposite electrical polarity to the top layer of the Si substrate100, is formed to yield a p-i-n photodiode/photodetector structure.

FIGS. 6A to 6E are the sectional views illustrating the manufacturingsteps of forming a photodiode with etch/polish stopper according toanother implementation of the present disclosure. As shown in FIG. 6A,the process can succeed the step S106 shown in FIG. 2D. The doped region102 and 110 are omitted here for simple illustrative purpose. A firstinterfacial layer 112 is formed atop the Si substrate 100, and a secondlayer 140 including Ge is formed atop the first interfacial layer 112.The first interfacial layer 112 (shown as an dashed box) can be used forcounter doping as described with reference to FIGS. 2A to 3C, or fordiffusion control as described with reference to FIGS. 4A to 4C, or amaterial with larger dielectric index than that of the second layer 140for bandwidth adjustment. Also shown in FIG. 6A, a passivation layer 30with material such as, but not limited to, Si (amorphous orpoly-crystalline), silicon oxide, nitride, high-k dielectric, or theircombinations is formed to passivate and protect the second layer 140.

As shown in FIG. 6B, a stopping layer 32 with material such as, but notlimited to, nitride is formed as a blanket layer atop the passivationlayer 30. In some implementations, the stopping layer can also includemultiple layers including oxide and nitride. In some implementations,the thickness of the stopping layer 32 ranges typically from, but notlimited to 10 A to 2000 A, with a thickness from 100 A to 500 A beingmore typical. Afterward, an interlayer dielectric (ILD) layer 34 is thendeposited to cover the whole mesa structure and can be optionally firstpre-planarized by either reflow or chemical mechanical polish (CMP)process as shown in FIG. 6C. The ILD layer 34 uses material such as, butnot limited to, silicon oxide which has different material compositionthan the stopping layer 32. As shown in FIG. 6D, the ILD layer 34 isprocessed by CMP process until the portion of the ILD layer 34 atop thestopping layer 32 is substantially removed. If a pre-planarized processin FIG. 6C is not performed, then a single planarizing process such asCMP can be used to form the structure in FIG. 6D. More particularly, theremoval process is designed to fully terminate on top of the mesastopping layer 32 with minimum thickness loss. Namely, the removalprocess for the ILD layer 34 needs to be highly selective to thestopping layer 32. For example, the selectivity could be larger than1:5. Afterward, as shown in FIG. 6E a reflector 36 is then uniformlydeposited on top of the stopping layer 32. With this approach, thethickness uniformity of the top reflector 36 can be well controlled byfilm deposition step instead of a polish process, meaning betteruniformity control than conventional planarization process. Thereflector 36 is used for either reflection or tuning optical cavity pathlength or combinations of both. In some implementations, a reflectorincluding a metal layer on top of a dielectric layer can achieve >95%reflectivity, wherein an optical signal incident from the bottom of FIG.6E can be reflected for further absorption of the second layer 140. Insome implementations, a reflector including oxide or nitride can beformed to achieve less than 50% reflectivity and an optical signal canincident from the top of FIG. 6E. In some implementations, ananti-reflection-coating (ARC) layer can be added between the externaloptical source and the second layer 140. The reflector can include onedielectric layer (e.g., oxide or nitride), multiple dielectric layers,metal (e.g., Aluminum), or any combinations of materials listed above.In some implementations, the reflector 36 can include dielectric such asoxide, or a metal layer such as Aluminum, or a metal layer on top of adielectric layer with its thickness close toquarter-effective-wavelength of the incident light. Reflectors generallyhave unique and strict thickness tolerance (<5%) to ensure high opticalyield, and in this implementation, a stopping (etch or polish stopping)layer 32 is provided in a photodiode/photodetector structure which willimprove the thickness uniformity control of the reflector structure.Note that the process flow provided above is not stated in specificorder and can be rearranged in any order. For example, another etchingprocess to further remove the stopping layer 32 can be added beforedepositing the reflector such that the CMP process induced thicknessvariation on the stopping layer 32 can be further reduced. In someimplementations, the stopping layer 32 is nitride and a wet etch processincluding phosphorus acid is used to remove the nitride beforedepositing the reflector 36. Moreover, in the above example, the secondlayer 140 forming a Ge epitaxial mesa region has lattice mismatch to thesurface of the Si substrate 100, and the reflector 36 has apredetermined thickness such that a predetermined reflectivity can beachieved when an optical signal passing and being reflected by thereflector 36, at least part of the optical signal is absorbed by thesecond layer 140.

FIGS. 7A to 7E are the sectional views illustrating the manufacturingsteps of forming a photodiode/photodetector with etch/polish stopperaccording to still another implementation of the present disclosure. Asshown in FIG. 7A, the process can succeed the step S102 shown in FIG.2B. The interfacial layer 112 can be used for counter doping asdescribed with reference to FIGS. 2A to 3C, or for diffusion control asdescribed with reference to FIGS. 4A to 4C, or be formed with largerdielectric index than that of the second layer 140 for bandwidthadjustment. A passivation layer 31 with material such as, but notlimited to, Si (amorphous or poly-crystalline) or silicon oxide ornitride or their combinations is formed on the resulting structure.Afterward, a stopping layer 33 with material such as, but not limitedto, nitride is formed atop the passivation layer. The thickness of thestopping layer 33 is typically from 10 A to 2000 A, with a thicknessfrom 100 A to 500 A being more typical. The passivation layer 31, thestopping layer 33 and the underlying Ge epitaxial layer 140 are thenpatterned simultaneously to form a mesa structure shown in FIG. 7A. Thenin FIG. 7B, a passivation spacer 35 is formed on the mesa (including thepassivation layer 31, the stopping layer 33, and the Ge epitaxial mesaregion 140) sidewall. In some implementations, the passivation spacer isformed by first conformally depositing a passivation film on the mesa toresult in a relatively thicker region near the sidewall. Then adirectional (anisotropic) etch is applied to remove the spacer materialon the field, leaving only the sidewall region with relatively thickerlayer remained as the spacer. Afterward, an interlayer dielectric (ILD)layer 34 is then deposited to cover up the whole mesa structure and canbe optionally pre-planarized by either reflow or chemical mechanicalpolish (CMP) process as shown in FIG. 7C. As shown in FIG. 7D, the ILDlayer 34 is processed by CMP process until the portion of the ILD layer34 atop the stopping layer region 33 is substantially removed, whether apre-planarized process is processed in FIG. 7C or not. If apre-planarized process in FIG. 7C is not performed, then a single polishprocess can be used to form the structure in FIG. 7D. Afterward, asshown in FIG. 7E a reflector 36 is then uniformly deposited on top ofthe stopping layer region 33, similar to what is described in FIG. 6E.

FIGS. 8A to 8F are the sectional views illustrating the manufacturingsteps of forming a photodiode/photodetector with etch/polish stopperaccording to still another implementation of the present disclosure. Theinitial steps illustrated by FIG. 8A to 8C are similar to thedescription of FIG. 7A to 7C, and in FIG. 8D, the ILD layer 34 isfurther processed by CMP process or etch back process and the processstops near the stopping layer region 33 with some over-polishing orover-etching on either the ILD 34 or the stopping layer 33. Compared toFIG. 7, in this implementation, the stopping layer 33 can be referred toas dummy stopping layer because it is removed at a later process, andtherefore, the removal process does not need to be selective to thestopping layer as described before, hence further improving the processflexibility. As shown in FIG. 8E, the dummy stopping layer 33 is thenremoved by wet chemical process or combination of wet and dry etchingprocess. The selected chemical can react only with stopping layer 33 andbe highly selective to the rest of the materials exposed such as the ILD34. For example, if the stopping layer is nitride, a phosphoric acidbased wet etch process can be used. Afterward, as shown in FIG. 8F areflector 36 is then uniformly deposited on top of the resultingstructure as described in FIGS. 6E and 7E. With this approach, thethickness uniformity of the top reflector 36 can be well controlled byfilm deposition step instead of a polish process, meaning betteruniformity control than conventional planarization process.

FIGS. 9A to 9D are the sectional views illustrating the manufacturingsteps of forming a photodiode/photodetector with conformal selective Geetch according to another implementation of the present disclosure. Asshown in FIG. 9A, the process can succeed the step S102 shown in FIG. 2Bwith an interfacial layer 40 placed between the epitaxial layer 130 andthe underlying Si substrate 100. In some implementations, the epitaxiallayer 130 includes Ge, the interfacial layer 40 can be an intrinsic Silayer functioning as a counter doping layer, a dopant diffusion layer orboth, and a passivation layer 42 made out of dielectric material isformed on the epitaxial layer 130. Afterward, as shown in FIG. 9B, thepassivation layer 42, the underlying epitaxial layer 130 and theinterfacial layer 40 are patterned fully or partially by RIE to form amesa structure 140. With the involvement of directional ion etching(e.g., RIE), it causes damage zone 43 for the epitaxial layer near themesa sidewall as shown in FIG. 9B. As shown in FIG. 9C, selective Geetch is performed to remove the damaged zone 43. This process will causea lateral recess 45 as shown in FIG. 9C. Since the top surface of theepitaxial layer 130 is covered by dielectric passivation layer 42, theetching process is mostly active on mesa sidewall. The methods ofperforming this conformal selective Ge etch will be further discussed inthe following description. Finally, as shown in FIG. 9D, in order toform a p-i-n or n-i-p structure, a thin layer 46 of the epitaxial layernear the top surface is converted into a highly-doped layer with itselectrical polarity opposite to substrate doped region 110. Note thatthe process stated above is not limited to specific order.

With reference again to FIG. 9C, three possible methods to achieveconformal selective Ge etch can be further described. The 1st approachis using wet chemical etching to achieve conformal (isotropic) Ge etchwith selectivity to Si. A typical Ge etch is normally performed in twosteps. The 1st step is an oxidation reaction in which the etchedmaterial is converted into a higher oxidation state. The 2nd step leadsto the dissolution of oxidation products. In one implementation, the wetetch chemistry includes but not limited to NH₄OH (dissolution) and H₂O₂(oxidant). Etch rate can be controlled by the level of H₂O dilution.Moreover, this etch chemistry has etch selectivity on Si. Mixed NH₄OHand H₂O₂ are used in Si industry for wafer cleaning and are known forvery low Si etch rate. The 2nd approach is using a fluorine, chlorine,and bromine-based RIE process with downstream plasma configuration. Itis observed that Ge is more reactive on the above chemistries withoutthe assistance of ion bombardment. The downstream plasma configurationcan provide a nearly damage free conformal etch without causing furthersidewall damages from directional ion bombardment. By properly tuningthe RIE conditions, an etch rate difference between Ge and Si of morethan 40 to 1 can be achieved using this approach. For the 3rd approach,a high temperature gas phase HCl etch is performed under reduced or lowpressure vacuum systems. HCl has gas chemistry that is capable ofetching Si and Ge. Since this is a gas phase etching without assistancefrom any directional ion bombardment, the reaction is conformal.Moreover, the activation temperatures of etching Ge and Si are verydifferent (more than 100 C), and hence when operating the etchingprocess at near 600 C, only Ge will be etched at this temperature range,thus creating an etch selectivity between Si and Ge. Moreover, the abovementioned processes can be applied to the other photodiodeimplementations mentioned elsewhere in this disclosure, for example, thefigures shown in FIGS. 6-8. For example, in FIGS. 7A and 8A, after mesaforming, the conformal selective Ge etch process can be introduced toremove part of the damaged sidewall of the second layer 140, leavingonly the undamaged second layer within a selected area, and then forminga spacer layer 35 as mentioned before covering at least part of theexposed sidewall of the second layer 140.

FIG. 9E is a sectional view showing photodiode with doping isolation. Inthis implementation, two absorption elements are defined by creating anopposite doping region between the two adjacent parts of the absorptionelements, and each element has its own top doping region and itssubstrate doping region. For example, if the substrate doping is N-typefor both elements, then the doping separation region is P-type. In someimplementations, if the light absorption region is slightly P-type, thenthe doping separation region is N-type. In some implementations, if theabsorption region includes Ge and the substrate is Si, their interfaciallayer could be P-type due to the surface trap states near the SiGeinterface, then the doping separation is N-type. The interfacial layer40 here may be introduced intentionally as dopant diffusion controllayer, or counter doping layer as described before; or it can indicatean inter-diffusion region between the upper Ge layer and Si substrateduring the Ge epitaxial growth thermal process.

FIGS. 10A to 10F are the sectional views illustrating the manufacturingsteps of forming a photodiode with sidewall passivation according to animplementation of the present disclosure. As shown in FIG. 10A, theprocess can succeed the step S100 shown in FIG. 2A, namely, a Sisubstrate 100 with doped layer 110. An isolation layer (such as a fielddielectric layer) 50 is then deposited on the upper surface of the Sisubstrate 100. As shown FIG. 10B, a selective area opening 50 a isdefined in the field dielectric layer 50 by photolithography andetching, where the selective area opening 50 a exposed a part (a firstselected area) of the surface of the doped layer 110. Afterward, asshown in FIG. 10C, a passivation layer 52 is deposited on the upper faceof the field dielectric layer 50 with the selective area opening 50 a.In some implementations, the passivation layer 52 is Si (amorphous orpoly-crystalline), nitride, or high-k dielectric. As shown in FIG. 10D,directional etch is performed to remove part of the passivation layer 52and only passivation spacer 52 a remains on the sidewall of theselective area opening 50 a (namely the inner surface of the fielddielectric layer 50). As shown in FIG. 10E, the first light absorptionlayer (such as photosensitive material layer including Ge) isselectively grown and fills the selective area opening 50 a, and then itis planarized by CMP process to form a photo-sensitive region 54. Beforeselectively growing the first light absorption layer, an interfaciallayer 112 may be optionally formed atop the first selected area. Theinterfacial layer 112 can be a counter doping layer as described withreference to FIGS. 2A to 3C, or dopant diffusion control layer asdescribed with reference to FIGS. 4A to 4C, or a bandwidth adjustmentlayer with smaller dielectric index than that of the photo-sensitiveregion 54. Finally, as shown in FIG. 10F, a doped region 56 is formedwithin the photo-sensitive region 54 near the surface. In someimplementations, the area of the doped region 56 can have differentshape from the photo-sensitive region 54 when viewing from the top. Forexample, the shape of the photo-sensitive region 54 may be rectangularand the shape of the doped region 56 may be circular. In someimplementations, the selective area opening 50 a is rectangular andsurrounded by (110) planes wherein when filled by a photo-sensitiveregion includes Ge can result in good surface passivation. In certainembodiments, other planes other than (110) can also be used to form therectangular. To reduce the junction capacitance, the doped layer 56 issmaller than the rectangular opening 50 b, and may be in a circularshape to substantially match the input optical beam profile. In someimplementations, the area of the doped region 56 can have similar shapeas the photo-sensitive region 54 when viewing from the top. For example,the shape of the photo-sensitive region 54 and the doped region 56 canboth be rectangular or circular. In some implementations, the shape ofthe photo-sensitive region 54 b and the doped layer 56 can bothrectangular with rounded corners.

Alternatively, as shown in FIG. 10G, the process can be bifurcated fromthe step after FIG. 10B, a seeding layer 58 is first grown within theselective area opening 50 a (seeding area). A CMP process may beperformed after the growth of the seeding layer. Subsequently, a secondisolation layer 501 is deposited on the resulting structure partiallyremoved to expose a second selected area. As shown in FIG. 10H, a spacer520 is formed on the sidewall corresponding to the second selected area.The exposed second selected area is then filled by the photo-sensitiveregion 54 and a passivation layer is deposited atop the photo-sensitiveregion 54, as shown in FIG. 10I. The steps described in FIG. 10H and 10Iare similar to the steps described in FIG. 10B to 10F except a seedinglayer is first grown within a seeding area before performing the stepsto form the spacer.

Alternatively, as shown in FIG. 10J, the process can be bifurcated frombefore step FIG. 10G. Prior to seeding layer filling of the selectivearea opening 50 a (seeding area), a bottom spacer 52 a can be formed onthe sidewall. As shown in FIG. 10K, a seeding layer 58 is grown withinthe selective area opening 50 a (seeding area) and a CMP process can beperformed after the growth of the seeding layer. At this point, thesteps described in FIG. 10H to 10I may be performed to form the upperlayer of photo-sensitive region 54. Subsequently, processes similar tothose described in FIGS. 2F to 2H or other variations can be applied toform the electrical contacts of the photodiode. In some implementations,the seeding layer may be Si, Ge, or SiGe with various Ge content. Thephoto-sensitive region may be Si, Ge or SiGe with various Ge content. Insome implementations, the photo-sensitive region exhibits higher Gecontent than the seeding layer. Furthermore, an interfacial layer may beinserted between the seeding layer and the substrate, or/and between thephoto-sensitive region and the substrate, or/and between the seedinglayer and the photo-sensitive region. In some implementations, theinterfacial layer can function as a counter doping layer, or/and adopant diffusion layer, or/and a bandwidth adjustment layer. In someimplementations, the seeding layer is of Si material functioning as adopant diffusion control layer to reduce the dopant diffusion from thesubstrate into the photo-sensitive region. In some implementations, theseeding layer has substantially the same material content as thephoto-sensitive region such as Ge. In some implementations, the seedinglayer may be grown separately from the photo-sensitive region above theseeding layer to reduce the thermal budget since other process stepssuch as forming silicide may be performed between the two growths. Suchtwo-step growth method enables higher overall achievable thickness forthe photo-sensitive region of substantially the same materialcompositions. In some implementations, an intentional or unintentionalsidewall misalignment exists between the seeding area and the secondselective area due the involvement of multiple lithography steps. Notethat the drawings shown in FIGS. 10 are for illustrative purpose andshould not be viewed in a restrictive sense. For example, in FIGS. 10Hand 10I, the spacer formation may also be optional in this two-stepdeposition/growth scenario, namely first forming a seeding region 58,then forming a second photo-sensitive region 54 without introducing thespacer 520. As another example, the thickness of the photo-sensitiveregion 54 may be thicker than the thickness of the seeding region 58,and the opening area for the photo-sensitive region 54 may be larger,equal, or smaller than the seeding region 58.

FIGS. 11A to 11G are the sectional views illustrating the manufacturingsteps of forming a photodiode with sidewall passivation according toanother implementation of the present disclosure. Similarly, the processcan succeed the step S100 shown in FIG. 2A, namely, a Si substrate 100with doped layer 110 and a field dielectric layer 50 deposited on thesurface of the Si substrate 100, as shown in FIG. 11A. In FIG. 11B, aselective area opening 50 a is defined in the field dielectric layer 50by photolithography and etching, where the selective area opening 50 aexposed a part of the surface of the Si substrate 100.

Subsequently, as shown in FIG. 11C, photosensitive materials such as Geor SiGe of various Ge content is selectively grown to at least partiallyfill the selective area opening 50 a to form a first photo-sensitiveregion 54 a, which functions as a seed layer and will be described inmore detail. In other implementations, prior to selectively growing thefirst photo-sensitive region 54 a, an interfacial layer 112 may beformed as a counter doping layer as described with reference to FIGS. 2Ato 3C, or as a diffusion control layer as described with reference toFIGS. 4A to 4C.

As shown in FIG. 11D, a passivation layer 53 is deposited on the uppersurface of the field dielectric layer 50 and the upper surface of thefirst photo-sensitive region 54 a. The material of the passivation layer53 may include Si (amorphous or poly-crystalline), oxide, nitride,high-k dielectric or their combinations. As shown in FIG. 11E,directional etch is performed to remove part of the passivation layer 53and only passivation spacer 53 a remains on the sidewall of theselective area opening 50 a. As shown in FIG. 11F, photosensitivematerial such as Ge is selectively grown to fill the remaining part ofthe selective area opening 50 a to form a second photo-sensitive region54 b, and the second photo-sensitive region 54 b is then planarized byCMP process. Finally, as shown in FIG. 11G, a doped layer 56 is formedwithin the second photo-sensitive region 54 b and near the upper surfaceof the second photo-sensitive region 54 b. In some implementations, thedoping type of doped layer 56 is p-type, and the doping type of thedoped region 110 is n-type. In some implementations, the doping type ofdoped layer 56 is n-type, and the doping type of the doped region 110 isp-type. In some implementations, the area of the doped layer 56 can havedifferent shape from the photo-sensitive region 54 b when viewing fromthe top. For example, the shape of the photo-sensitive region 54 b maybe rectangular and the shape of the doped layer 56 may be circular. Insome implementations, the selective area opening 50 a is rectangular andsurrounded by (110) planes wherein when filled by a photo-sensitiveregion includes Ge can result in good surface passivation. In certainembodiments, other planes other than (110) can also be used to form therectangular. To reduce the junction capacitance, the doped layer 56 issmaller than the rectangular opening 50 b, and may be in a circularshape to substantially match the input optical beam profile. In someimplementations, the area of the doped layer 56 can have similar shapeas the photo-sensitive region 54 b when viewing from the top. Forexample, the shape of the photo-sensitive region 54 b and the dopedlayer 56 can both be rectangular or circular. In some implementations,the shape of the photo-sensitive region 54 b and the doped layer 56 canboth rectangular with rounded corners. Upon completion of process stepsshown in FIG. 11G, subsequent processes similar to those shown in FIGS.2F to 2H or other variations may be performed to form the electricalcontacts of the photodiode.

FIG. 11H is a section view showing the photodiode with sidewallpassivation according to still another implementation of the presentdisclosure. The photodiode shown in FIG. 11H is similar to that shown inFIG. 11G except a passivation layer 150 is formed atop the doped layer56 and the second photo-sensitive region 54 b. FIG. 11I is a sectionview showing the photodiode with sidewall passivation according to stillanother implementation of the present disclosure. The photodiode shownin FIG. 11I is similar to that shown in FIG. 11G except that theinterfacial layer 112 can be omitted in this implementation. FIG. 11J isa section view showing the photodiode with sidewall passivationaccording to still another implementation of the present disclosure. Thephotodiode shown in FIG. 11J is similar to that shown in FIG. 11G exceptthat the interfacial layer 112 is placed between the firstphoto-sensitive region 54 a and the second photo-sensitive region 54 b.FIG. 11K is a section view showing the photodiode with sidewallpassivation according to still another implementation of the presentdisclosure. The photodiode shown in FIG. 11K is similar to that shown inFIG. 11G except that two interfacial layers 112 a and 112 b are employedin this implementation. Namely, the first interfacial layers 112 a isplaced between the first photo-sensitive region 54 a and the secondphoto-sensitive region 54 b, and the second first interfacial layers 112b is placed between the doped layer 110 and the second photo-sensitiveregion 54 b. Note that in FIG. 11, the illustration of a complete layerregion and a dashed box region both indicates the existence of aninterfacial layer 112. The aforementioned “surface of the Si substrate100” is interchangeable with “surface of the doped layer 110” in certainimplementations.

FIGS. 12A to 12G are the sectional views illustrating the manufacturingsteps of forming a photodiode with sidewall passivation according toanother implementation of the present disclosure. Similarly, the processcan succeed the step S100 shown in FIG. 2A. In FIG. 12A, a Si substrate100 with doped layer 110 and a field dielectric layer 51 a deposited onthe surface of the Si substrate 100. A selective area opening 50 a isdefined in the field dielectric layer 51 a by photolithography andetching, where the selective area opening 50 a exposed a part of thesurface of the Si substrate 100. Subsequently, a seeding layer 54 a isselectively grown to fill the selective area opening 50 a. In someimplementations, before selectively growing the first photo-sensitiveregion 54 a, an interfacial layer 112 can be formed as a counter dopingas described with reference to FIGS. 2A to 3C, or as a diffusion controlas described with reference to FIGS. 4A to 4C. In some implementations,an optional CMP process can be performed after the growth of the seedinglayer 54 a. In FIG. 12B, a second isolation layer 51 b is deposited, andpart of the second isolation layer 51 b is removed to expose a secondselected area 50 b as shown in FIG. 12C. Note that in certain actualprocess implementations, a sidewall misalignment may exist between theselective opening 50 a and the second selected area 50 b due to twoseparate lithography steps involved.

In FIG. 12D, a passivation layer 53 is deposited. In someimplementations, the material of the passivation layer 53 can be Si(amorphous or poly-crystalline), oxide, nitride, high-k dielectric(e.g., Al₂O₃, HfO₂) or their combinations. As shown in FIG. 12E,directional etch is performed to partially remove the passivation layer53 and only passivation spacer 53 a remains on the sidewall of theselective area opening 50 b (namely the inner surface of the fielddielectric layer 51 b).

As shown in FIG. 12F, photosensitive material such as Ge is selectivelygrown to fill the remaining part of the selective area opening 50 b toform a second photo-sensitive region 54 b, and the secondphoto-sensitive region 54 b is then planarized by CMP process. Finally,as shown in FIG. 12G, a doped layer 56 is formed within the secondphoto-sensitive region 54 b and near the upper surface of the secondphoto-sensitive region 54 b. In some implementations, the doping type ofdoped layer 56 is P-type, and the doping type of the doped region 110 isn-type. In some implementations, the doping type of doped layer 56 isn-type, and the doping type of the doped region 110 is p-type. In someimplementations, the area of the doped layer 56 can have different shapefrom the photo-sensitive region 54 b when viewing from the top. Forexample, the shape of the photo-sensitive region 54 b may be rectangularand the shape of the doped layer 56 may be circular. In someimplementations, the selective area opening 50 b is rectangular andsurrounded by (110) planes wherein when filled by a photo-sensitiveregion includes Ge can result in good surface passivation. In certainembodiments, other planes other than (110) can also be used to form therectangular. To reduce the junction capacitance, the doped layer 56 issmaller than the rectangular opening 50 b, and may be in a circularshape to substantially match the input optical beam profile. In someimplementations, the area of the doped layer 56 may have similar shapeas the photo-sensitive region 54 when viewing from the top. For example,the shape of the photo-sensitive region 54 and the doped layer 56 canboth be rectangular or circular. For example, the shape of thephoto-sensitive region 54 and the doped layer 56 can both be rectangularwith rounded corners. Upon completion of process steps shown in FIG.12G, subsequent processes similar to that shown in FIGS. 2F to 2H orother variations may be performed to form the electrical contacts of thephotodiode.

FIG. 12H is a section view showing the photodiode with sidewallpassivation according to still another implementation of the presentdisclosure. The photodiode shown in FIG. 12H is similar to that shown inFIG. 12G except a passivation layer 150 is formed atop the doped layer56 and the second photo-sensitive region 54 b. FIG. 12I is a sectionview showing the photodiode with sidewall passivation according to stillanother implementation of the present disclosure. The photodiode shownin FIG. 12I is similar to that shown in FIG. 12G except that theinterfacial layer 112 can be omitted in this implementation. FIG. 12J isa section view showing the photodiode with sidewall passivationaccording to still another implementation of the present disclosure. Thephotodiode shown in FIG. 12J is similar to that shown in FIG. 12G exceptthat the interfacial layer 112 is placed between the firstphoto-sensitive region 54 a and the second photo-sensitive region 54 b.FIG. 12K is a section view showing the photodiode with sidewallpassivation according to still another implementation of the presentdisclosure. The photodiode shown in FIG. 12K is similar to that shown inFIG. 12G except that two interfacial layers 112 a and 112 b are employedin this implementation. Namely, the first interfacial layers 112 a isplaced between the first photo-sensitive region 54 a and the secondphoto-sensitive region 54 b, and the second interfacial layers 112 b isplaced between the doped layer 110 and the second photo-sensitive region54 b. Note that in FIG. 12, the illustration of a complete layer regionand a dashed box region both indicates the existence of an interfaciallayer 112. Also note that the drawings shown in FIG. 12 are forillustrative purpose and should not be viewed in a restrictive sense.For example, in FIGS. 12D to 12K, the spacer formation may also beoptional in this two-step deposition/growth scenario, namely firstforming a seeding region 54 a, then forming a second photo-sensitiveregion 54 b without introducing the spacer 53 a. As another example, thethickness of the photo-sensitive region 54 b can be thicker or thinnerthan the thickness of the seeding region 54 a, and the opening area forthe photo-sensitive region 54 b can be larger, equal, or smaller thanthe seeding region 54 a. The aforementioned “surface of the Si substrate100” is interchangeable with “surface of the N doped layer 110” incertain embodiments.

FIG. 13 is a sectional view showing the photodiode of the presentdisclosure integrated with a transistor. A high doping region isprovided at the substrate 100 for the source 72 and drain 74 region of atransistor 70. The isolation between the photodiode and the transistorcan be done by shallow trench isolation, P-N junction isolation, thermaloxide or other forms of isolation.

Although the present invention has been described with reference tospecific exemplary embodiments, it will be recognized that any and allof the implementations described above can be combined with each other,and the invention is not limited to the implementations described, butcan be practiced with modification and alteration within the spirit andscope of this invention. Accordingly, the specification and drawings areto be regarded in an illustrative sense rather than a restrictive sense.

In some implementations, the materials of the interfacial layer, theseeding layer and the photo-sensitive region can be Si, Ge or SiGe withvarious Ge content. In some implementations, the photo-sensitive regionhas higher Ge content than the seeding layer. Furthermore, aninterfacial layer can be inserted between the seeding layer and thesubstrate, or/and between the photo-sensitive region and the substrate,or/and between the seeding layer and the photo-sensitive region. In someimplementations, the interfacial layer can function as a counter dopinglayer, or/and a dopant diffusion layer, or/and a bandwidth adjustmentlayer. In some implementations, the seeding layer includes Si andfunctions as dopant diffusion control layer to reduce the dopantdiffusion from the substrate into the photo-sensitive region.

In some implementations, the seeding layer has substantially the samematerial content as the photo-sensitive region such as Ge. In certainembodiments, the seeding layer may be grown separately from thephoto-sensitive region above the seeding layer to reduce the thermalbudget since other process steps such as forming silicide may beperformed between the two growths. Such two-step growth method enableshigher overall achievable thickness for the photo-sensitive region ofsubstantially the same material compositions. In some implementations,an intentional or unintentional sidewall misalignment exists between theseeding area and the second selective area due to the multiplelithography steps involved. In some implementations where selectivegrowth is performed, a sloped shape can be formed during the growthstep, and later be polished by CMP step as mentioned in this disclosure.For example, a (311) plane can be formed if Ge is selectivelyepitaxially grown on a surface. In some implementations, a recessedstructure can be included before forming the substrate doping and theinterfacial layer. In some implementations, a spacer can also be formedto cover the sidewall of the recess area according to the spacerformation process described before. Also note that certain actualimplementation induced imperfections should also be covered in thisdisclosure as long as its concept follows this disclosure. Anyvariations, derivations from the description above should also be viewedas included in this invention.

Prevention of Substrate Backside Contamination from Blanket

Chemical-Vapor-Deposition (CVD) based Heteroepitaxy

As mentioned earlier, a heterogeneous interface can exist between twolayers of different materials. A heterogeneous interface can befabricated using a device manufacturing process called heteroepitaxy, atype of epitaxy performed by growing a crystalline material of differentelemental configurations than the crystalline substrate that is grownon. FIG. 14 shows a conventional CVD-based heteroepitaxial process, inwhich a different single crystal material 1410 is grown on top of asingle crystal substrate 1400. As illustrated in FIG. 14, theconventional CVD-based heteroepitaxial process may cause substratebackside contamination. Specifically, the precursor gas used in suchconventional heteroepitaxial process can sometimes flow underneath thesubstrate 1400 and deposit an unwanted thin layer of epitaxial material1420 on the backside of the substrate 1400, and/or potentially on thebackside's edges. This unwanted backside layer 1420 can lead to seriouscross contamination issue when the manufacturing line is being utilizedto produce more than one type of product, which normally is the casewith a silicon device fabrication foundry. In some instances, thebackside heteroepitaxial material 1420 can transfer onto the handlingtools after the epitaxial step, for example, during the wafer handlingand/or processing stages. This cross contamination can potentially causeprocess drifts, yield degradation, and reliability issues for otherproducts. Additionally, this may even pose serious health risks andenvironmental issues when the heteroepitaxial material is toxic, such asarsenic(As)-based III-V materials. Accordingly, introduced herein are anumber of techniques that can reduce or solve this backsidecontamination issue.

FIG. 15 shows an embodiment of a technique for reducing substratebackside contamination from blanket CVD-based heteroepitaxy. Thestructure as shown in FIG. 15 includes a semiconductor substrate 1500, aheteroepitaxial material layer 1510 on top of the substrate 1500, and anoxide or nitride based dielectric layer 1530 on the backside of thesubstrate 1500. Specifically, it is observed in the present disclosurethat, for a CVD-based heteroepitaxy process, the heteroepitaxy materialtypically nucleates much slower on oxide or nitride based dielectrics(e.g., the dielectric layer 1530). Therefore, with a combination of thistechnique and other known growth condition tuning skills, a growthcondition can be derived for a specific application in which theheteroepitaxy material 1510 can grow only on the crystalline substrate1500 but not on backside dielectrics 1530. In this way, theabovementioned backside contamination issue can be much reduced or evencompletely avoided.

It is further noted that, in cases where contamination requirements aremore stringent (e.g., growing As-based materials), the backsidedielectric 1530 can be selectively removed, for example, by either wetchemicals or dry etching. With this extra, optional step, any smallnucleus formed on the dielectric 1530 during the heteroetpiaxy processcan be removed to produce a substantially contamination-free substratebackside (e.g., with a contamination specie surface concentration below1×10¹⁰/cm²).

FIGS. 16A to 16F are example silicon-based processes scheme formanufacturing the embodiment shown in FIG. 15. In FIG. 16A, the firststep, a thin oxide layer 1640 (e.g., SiO) is first deposited on top of asilicon (Si) substrate 1600, followed by a nitride layer deposition thatforms a nitride layer 1650 (e.g., SiN) on top of the oxide layer 1640.In some implementations, a plasma-enhanced chemical vapor deposition(PECVD) SiN can be used avoid backside nitride deposition. In FIG. 16B,the second step, a portion of the nitride layer 1650 that is near thewafer's edge is removed, for example, by reactive ion etching. Theetching pattern can be defined by a photoresist mask 1660. In FIG. 16C,the third step, a thermal oxide 1630 is grown pervasively over the waferto encompass the wafer except for the nitride-covered area 1650. Thisthermal oxide 1630 is functionally equivalent to the dielectric layer1530, discussed with respect to FIG. 15, in order to provide selectivityduring the later heteroepitaxial growth. In FIG. 16D, the fourth step,the nitride layer 1650 is selectively removed and the thin bottom oxide1640 exposed. One example way to selectively remove the nitride 1650without losing the thin oxide 1640 is to utilize hot phosphoric acid.The thin oxide 1640 can be used here as a surface protection layer toincrease the surface quality for the following heteroepitaxy step.

In FIG. 16E, the fifth step, the thin oxide layer 1640 is first removed,for example, by hydrogen fluoride (HF) based chemicals. Then, the waferis moved into a CVD chamber for growing heteroepitaxial material. Thegrowth condition may be tuned by process engineers with known tuningskills so that the heteroepitaxial material grows only on the areapreviously covered with nitride 1650 but now exposed after the nitrideremoval process. Because the thermal oxide region 1630 is difficult forheteroepitaxial material to nucleate, the disclosed technique cansubstantially reduce possible contamination on the backside and thefront edge areas of the wafer.

As an optional step, shown in FIG. 16F, in cases where the contaminationrequirements are more stringent (e.g., growing an As-based material, orwhere the adopted heteroepitaxy process is not selective enough to avoidgrowth on the backside dielectric 1630), the backside dielectric 1630can be selectively removed after the epitaxial step, by either wetchemicals or dry etching, to further reduce the probability of crosscontamination.

FIG. 17 shows a photodetector structure on which the introducedtechnique for reducing substrate backside contamination is applied. Inthe photodetector shown in FIG. 17, the photosensitive layer 1710 isepitaxially deposited on top of the substrate 1700 with backside coveredwith dielectrics 1730. This technique can help ensure a clean backsidesubstrate to avoid cross-contamination issues after the epitaxial step.Moreover, the introduced technique can be applied on monolithicintegration processes where photodetectors and field effect transistorsare fabricated on the same chip. In one or more embodiments, thesubstrate can be silicon (Si), photosensitive layer can be germanium(Ge), and the backside dielectric can be oxide or nitride. In this way,in an epitaxial equipment configuration where one framework is shared bymultiple chambers, the robot arm shared by the multiple chambers toload/unload the wafers can be free of Ge (for example) when the robotcontacts the backside of the wafer. In some implementations, forexample, if there is more than one layer deposited at the backside ofthe wafer, the backside dielectric layer introduced here may be oxide.

Additional Fabrication Techniques for Frontside Incidence Double-passPhotodetectors (PDs) and for Integration with ComplementaryMetal-Oxide-Semiconductor (CMOS) Field Effect Transistors (FETs)

In conventional photodetector (PD) designs, there is an inherenttrade-off between responsivity and bandwidth. Traditionally, theresponsivity is directly proportional to the path length that the lighttravels in the light absorption material (e.g., germanium). Consider aconventional normal incidence photodetector as an example. The thickerthe absorption layer is, the higher the responsivity is. Unfortunately,a thicker absorption layer almost always features the drawback of longercarrier transit time that reduces the bandwidth of photodetectors. Thisissue exacerbates with the ever increasing demand for high speed opticalreceivers.

A double pass photodetector is one type of solution to improve theresponsivity at higher speed. In a double pass PD, an additional mirrorcan be placed at the back of a normal incidence PD. This mirror canreflect those photons that have not yet been absorbed back to the PD'sphotosensitive layer for another round of absorption. By adding thisextra photon pass to the PD, the responsivity thereof can be improved.With the aforementioned discussion regarding the double pass PD in mind,the location where the backside mirror is placed is important to theperformance of the double pass PD design. If the mirror is placed toofar away (e.g., more than 10 μm) from the PD's active area, the mirrormay lose its reflecting effectiveness. This criterion makes double passfrontside incidence PDs difficult to manufacture because of the processcontrol involved with and the precision needed in backside etching.

Accordingly, introduced here are techniques for increased precision andcontrol in the backside etching process of double pass frontsideincidence PD, by using an extra etch-stop layer.

FIGS. 18A to 18C are sectional views of a frontside incidencedouble-pass photodetector with an epitaxially grown etch-stop layer1810, in accordance with some embodiments. The epitaxially grownetch-stop layer 1810 is implemented for increased precision in backsideetching control. First, starting with a substrate 1800, an etch-stoplayer 1810 is epitaxially grown on the substrate 1800, followed bysubstrate material regrowth that forms a regrown substrate layer 1805.The thickness of the regrown substrate material layer 1805 can beprecisely controlled through the epitaxy process, and this thickness mayeventually determine the final optical path/distance between the PD andits backside mirror. Then, a device active layer 1820 is formed on thisregrown substrate layer 1805, e.g., via implantation isolation and/orshallow trench isolation processes. Next, a PD photosensitive layer 1830is grown on top of this regrown substrate layer 1805. Thereafter,additional PD manufacturing processes, such as those mentioned above,can be performed to complete the frontside PD processes including, forexample, diode mesa patterning, contact via formation and metal tracepatterning.

Patterned backside etching is then performed to remove the substratematerial underneath the PD. For example, in a Si/Ge based PD system, thesubstrate material can be silicon (Si), the photosensitive material canbe germanium (Ge), and the material(s) for the etch-stop layer 1810 canbe silicon carbide (SiC), carbon-doped silicon, silicon germanium(SiGe), carbon-doped SiGe or carbon-doped Ge. It is observed here thatSiC or carbon-doped Si typically can provide a desirable etchselectivity to Si by dry etching. Similarly, SiGe or Ge typically canprovide a desirable etch selectivity to Si by wet etching.

Three different example schemes of the backside process are shown in thesectional views of FIGS. 18A to 18C. As shown in FIG. 18A, the backsideetching is fully stopped on the stopping layer 1810. A backside mirror1840 is then deposited on the back to cover the exposed portion of theetch-stop layer 1810. A typical mirror structure 1840 can include adielectric mirror layer 1842 and a metal mirror layer 1844. Other typesof mirror can also be adapted.

In FIG. 18B, a portion of the etch-stop layer 1810 that is exposed bythe back etching process is converted to an etch-stop oxide 1812. Thematerial conversion may be performed after the backside etching bytraditional oxidation processes. In a Si/Ge based PD system, thisetch-stop oxide layer 1812 can be, for example, SiGeO, which isconverted from the original, epitaxial SiGe etch-stop layer. It isobserved in the present disclosure that oxide generally has betteretching selectivity to semiconductor materials (e.g., Si/Ge), andtherefore it can be a better material option for functioning as anetch-stop layer, depending on the specific application. After theformation of the etch-stop oxide layer 1812, the aforementioned mirrorstructure 1840 is deposited on the back of the wafer, similar to FIG.18A.

In yet another variation, such as shown in FIG. 18C, a select portion ofthe etch-stop layer 1810 is removed after being exposed from thebackside etching. This technique is useful in some cases where theetch-stop layer 1810 cannot provide enough selectivity to the substratematerial, which can cause undesirable thickness variation across thewafer. Thickness variation is undesirable because the length of opticalpath may vary across the wafer, thereby causing performance variation,since the double pass PD's performance is dependent upon the opticalpath. In these cases, the selective removal of this etch-stop layer 1810can provide an additional level of etch selectivity, which in turnprovides a better optical path control. After the selective removal ofthe etch-stop layer 1810, the mirror structure is deposited on the backof the wafer to complete the process.

FIGS. 19A to 19F are different examples of integrating the PD structuresintroduced in FIGS. 18A to 18C with CMOS transistors. As mentionedearlier (e.g., with respect to FIG. 13), a PD disclosed in the presentdisclosure may be integrated with a transistor on the same wafer. Suchintegration is generally known as monolithic integration. Introducedhere are two example ways to implement the monolithic integration of thePDs and the CMOS transistors, together with the aforementioned PDepitaxial etch-stop layer techniques introduced in FIGS. 18A to 18C.

The first example approach is to grow the epitaxial stopping layerpervasively to cover the entire surface area of the substrate, and touse the epitaxial regrown substrate layer as the active areas for bothPDs and CMOS transistors. This approach is shown in the following threefigures, FIGS. 19A to 19C. These three figures respectively show thethree different PD subcategories introduced in FIGS. 18A to 18C,integrated with CMOS transistors on the same wafer.

The second approach is to grow the epitaxial stopping layer underneaththe PD active area only. This approach can be done by selectively recessthe PD area after standard shallow trench isolation (STI) processes. Insome embodiments, the growth of epitaxial stopping layer and thefollowing substrate material can both be done selectively on the PD areaonly. This approach is shown in the following three figures, FIGS. 19Dto 19F, each of which corresponds to a different PD subcategoryintroduced in FIGS. 18A to 18C.

FIG. 20 shows another technique to implement the etch-stop layerintroduced here. As shown in FIG. 20, a dielectric etch-stop layer 2010(e.g., oxide or nitride) can be first deposited on the substrate 2000 asthe backside etch-stop layer, as introduced above. Then, an epitaxiallayer overgrowth (ELO) technique is used to grow epitaxial substratematerial 2005 on top of this etch stop dielectric layer 2010. The ELOprocess includes: (1) drilling holes on the oxide layer 2010 down to thesubstrate material 2000; (2) epitaxially growing substrate material fromthe bottom substrate 2000 (as seeds) through the opened holes; (3)merging these substrate seeds into one epitaxial bulk layer 2005; and(4) polishing the epitaxial layer 2005's surface, which prepares it forthe device fabrication processes that follow. The device fabricationprocesses include growing a photosensitive layer 2030 of the PD on topof this epitaxial layer 2005. Afterwards, PD fabrication processes suchas those discussed herein can be performed to complete the frontsideprocesses including, for example, diode mesa patterning, contact viaformation and metal trace patterning. Next, patterned backside etchingis performed to remove the substrate material underneath the PD. Thedielectric etch-stop layer 2010 is used as the stopping layer for thisbackside etching step. Then, a mirror structure 2040 is placed on thebackside to complete the double-side PD process.

FIG. 21 shows an example of integrating the PD structure introduced inFIG. 20 with transistors. In one or more embodiments, the dielectricmaterial for the stopping layer can be the same silicon oxide that isused for standard STI processes.

CONCLUSION

While this specification contains many details, these should not beconstrued as limitations, but rather as descriptions of featuresspecific to particular embodiments. Certain features that are describedin this specification in the context of separate embodiments orimplementations may also be implemented in combination in a singleembodiment. Conversely, various features that are described in thecontext of a single embodiment may also be implemented in multipleembodiments separately or in any suitable subcombination. Moreover,although features may be described above as acting in certaincombinations and even initially claimed as such, one or more featuresfrom a claimed combination may in some cases be excised from thecombination, and the claimed combination may be directed to asubcombination or variation of a subcombination.

Similarly, while operations are depicted in the drawings in a particularorder, this should not be understood as requiring that such operationsbe performed in the particular order shown or in sequential order, orthat all illustrated operations be performed, to achieve desirableresults. In certain circumstances, multitasking and parallel processingmay be advantageous. Moreover, the separation of various systemcomponents in the embodiments described above should not be understoodas requiring such separation in all embodiments.

Thus, particular embodiments have been described. Other embodiments arewithin the scope of the following claims. For example, the actionsrecited in the claims may be performed in a different order and stillachieve desirable results.

What is claimed is:
 1. A method for forming a light absorptionapparatus, the method comprising: forming a stopping layer atop asubstrate; forming an additional substrate layer atop the stoppinglayer; forming a photosensitive structure above the additional substratelayer; creating an opening on a backside of the substrate to expose aportion of the stopping layer; and forming, through the opening on thebackside of the substrate, a reflector layer below the photosensitivestructure, wherein the additional substrate layer comprises verticalholes in the exposed portion of the stopping layer.
 2. The method ofclaim 1, wherein the reflector layer is configured to reflect light intothe photosensitive structure.
 3. The method of claim 1, wherein formingthe reflector layer comprises: forming a dielectric mirror layer belowthe exposed portion of the stopping layer; and forming a metal mirrorlayer below the dielectric mirror layer.
 4. The method of claim 1,wherein the reflector layer is below the exposed portion of the stoppinglayer.
 5. The method of claim 1, further comprising: before forming thereflector layer, removing at least a portion of the stopping layer. 6.The method of claim 5, wherein forming the reflector layer comprises:forming a dielectric mirror layer at a level of the portion of thestopping layer that is removed; and forming a metal mirror layer belowthe dielectric mirror layer.
 7. The method of claim 1, wherein thereflector layer is at a same level as the exposed portion of thestopping layer.
 8. The method of claim 1, further comprising: beforeforming the reflector layer, converting at least a portion of thestopping layer to another material.
 9. The method of claim 8, whereinthe converting comprises an oxidation process, and wherein the anothermaterial is an oxide.
 10. The method of claim 1, wherein the stoppinglayer comprises one or more of: a dielectric material including oxide ornitride, silicon carbide (SiC), carbon-doped silicon (Si), silicongermanium (SiGe), carbon-doped SiGe, or carbon-doped Ge.
 11. The methodof claim 1, wherein forming the additional substrate layer comprises:opening holes on the exposed portion of the stopping layer; forming,from the backside of the substrate and through the opened holes, a seedlayer of substrate material atop the stopping layer; and formingremainder of the additional substrate layer atop the seed layer.
 12. Themethod of claim 1, further comprising: before forming the photosensitivestructure, forming a contamination protection layer on the backside ofthe substrate.
 13. The method of claim 12, wherein the contaminationprotection layer comprises oxide or nitride.
 14. The method of claim 12,further comprising: removing at least a portion of the contaminationprotection layer on the backside of the substrate after forming thephotosensitive structure.
 15. A semiconductor fabrication systemincluding one or more machines for fabricating a light absorptionapparatus, the one or more machines configured to perform operationscomprising: forming a stopping layer atop a substrate; forming anadditional substrate layer atop the stopping layer; forming aphotosensitive structure above the additional substrate layer; creatingan opening on a backside of the substrate to expose a portion of thestopping layer; and forming, through the opening on the backside of thesubstrate, a reflector layer below the photosensitive structure, whereinthe additional substrate layer comprises vertical holes in the exposedportion of the stopping layer.
 16. The system of claim 15, wherein thereflector layer is configured to reflect light into the photosensitivestructure.
 17. The system of claim 15, wherein forming the reflectorlayer comprises: forming a dielectric mirror layer below the exposedportion of the stopping layer; and forming a metal mirror layer belowthe dielectric mirror layer.
 18. The system of claim 15, wherein thereflector layer is below the exposed portion of the stopping layer. 19.The system of claim 15, the operations further comprising: beforeforming the reflector layer, removing at least a portion of the stoppinglayer.
 20. The system of claim 19, wherein forming the reflector layercomprises: forming a dielectric mirror layer at a level of the portionof the stopping layer that is removed; and forming a metal mirror layerbelow the dielectric mirror layer.
 21. The system of claim 15, whereinthe reflector layer is at a same level as the exposed portion of thestopping layer.
 22. The system of claim 15, the operations furthercomprising: before forming the reflector layer, converting at least aportion of the stopping layer to another material.
 23. The system ofclaim 22, wherein the converting comprises an oxidation process, andwherein the another material is an oxide.
 24. The system of claim 15,wherein the stopping layer comprises one or more of: a dielectricmaterial including oxide or nitride, silicon carbide (SiC), carbon-dopedsilicon (Si), silicon germanium (SiGe), carbon-doped SiGe, orcarbon-doped Ge.
 25. The system of claim 15, wherein forming theadditional substrate layer comprises: opening holes on the exposedportion of the stopping layer; forming, from the backside of thesubstrate and through the opened holes, a seed layer of substratematerial atop the stopping layer; and forming remainder of theadditional substrate layer atop the seed layer.
 26. The system of claim15, the operations further comprising: before forming the photosensitivestructure, forming a contamination protection layer on the backside ofthe substrate.
 27. The system of claim 26, wherein the contaminationprotection layer comprises oxide or nitride.
 28. The system of claim 26,the operations further comprising: removing at least a portion of thecontamination protection layer on the backside of the substrate afterforming the photosensitive structure.